XSW-320

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XSW-320

TE1 stabilized SWIR OEM module

SWIR OEM module designed for cost-sensitive volume markets

The XSW-320 SWIR module is a shortwave infrared OEM module with a resolution of 320 x 256 pixels and a pixel pitch of 20 µm. It is equipped with a single-stage thermoelectric cooler which guarantees low noise and dark current characteristics. The XSW-320 is available with a variety of interfaces and has a small form factor, low weight and low power consumption (SWaP). This makes this SWIR OEM module easy to integrate into your industrial or security system. 

The XSW-320 SWIR module can look through glass so you can use standard available (C-Mount) glass lenses and protective housings. 

 

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Feature

  • 2 versions available
    We offer a basic 100 Hz version and an advanced 400 Hz version
  • Easy connectivity
    Various interfaces available
  • Made in Europe
    Easy to export - no ITAR restrictions
  • Small 20µm pixel pitch
    Excellent trade off between sensitivity, noise and format

设计用于使用

  • Food inspection
    Bruises on food can be detected due to the higher moisture content which will appear darker in the SWIR images
  • Hyperspectral imaging
    Combination of spectral imaging and 2D imaging. Our SWIR camera are used for hyperspectral SWIR imaging
  • Laser beam profiling
    Laser beam analysis for infrared lasers at, e.g., 1064, 1300 and 1550 nm
  • Night vision
    SWIR imagers can be used for day and starlight imaging
  • Semiconductor inspection
    SWIR cameras are able to see through silicon
  • Solar cell inspection
    Inspection techniques for crack inspection or efficiency mapping based on electroluminescence or photoluminescence
  • Waste sorting
    SWIR camera are used to check and compare reflectance values for different waste materials

特征

Compatible with a variety of framegrabbers

Several compatible frame grabbers for CameraLink interface are available (Euresys Grablink Full, NI 1433 and Imperx Framelink Express VCE-CLEX01).

GigE Vision standard compatibility

The Gigabit Ethernet interface is compatible to the GigE Vision standard

Video output

Analog video output available

SWaP (Small size, weight and power )

Small volume, low weight and low power consumption for demanding applications

Trigger

External trigger for signal synchronization

Windowing mode

Imaging in a reduced window of interest for increased frame rates

TrueNUC image correction

Non uniformity correction for a wide range of integration times

High dynamic range

High dynamic range mode available

摄像头规格

Array Specifications

Array Specifications XSW-320
Array type InGaAs Focal Plan Array (FPA) ROIC with CTIA topology
Resolution 320 x 256
Pixel pitch 20 μm
Spectral band 0.9 μm to 1.7 μm
Pixel operability > 99 %
Readout mode Integrate Then Read (ITR)
Array cooling TE1-stabilized
ROIC noise 60 e-
Dark current 0.19 x 10⁶ e-/s/pixel or 30 fA @ 200 mV bias at 288 K
Full well capacity 125 k e-

Module Specifications

Module Specifications XSW-320-Samtec XSW-320-Analog XSW-320-GigE XSW-320-CL
Maximum frame rate (full frame) 100 Hz or 400 Hz
Window of interest Minimum size 32 x 4 (only for 400 Hz model)
Exposure time range 1 µs to 40 ms
Noise 110 e-
Dynamic range 61 dB
ADC 14 bit
On-board image processing Auto-Gain, Auto-Offset Auto-Gain, Auto-Offset, Auto-Exposure
Interfaces
Optical interface C-mount
Digital output 16bitDV/BT.656 - GigE Vision CameraLink
Analog output - PAL or NTSC -
Module control Samtec RS232 (XSP) GigE Vision CameraLink
Trigger Trigger in or out (configurable)
Power requirements
Power consumption 2.5 W 3 W 4 W 2.8 W
Power supply 12 V
Physical characteristics
Ambient operating temperature range -40ºC to 70ºC (industrial components)
Storage temperature range -40ºC to 85ºC (industrial components)
Dimensions (W x H x L mmᵌ) 45 x 45 x 51 45 x 45 x 55 45 x 45 x 65 45 x 45 x 55
Weight module 120 g 145 g 165 g 129 g

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镜头和过滤器选项

软件

  • Xeneth
  • Xeneth SDK (optional)

小册子

Modules & components brochure XSW-320

World's first InGaAs camera photon emission microscope

Xenics enabled Semicaps to realize the world's first InGaAs camera photon emission microscope in 2004. Since then Xenics and sInfraRed have supported us in our endeavors for better sensitivity and resolution in photon and thermal emission microscopy.

Chua Choon Meng, CEO Semicaps