XSW-640

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XSW-640

高分辨率TE1-稳定SWIR OEM模块

易于集成且耗电量极低的SWIR OEM模块

Xenics’的XSW-640 OEM模块 非常紧凑且通用, 可轻易并快速地集成到您的SWIR 成像配置中。

普通的OEM应用包括: 人物红外成像、–便携式 和无人(航空和陆基) 设备有效载荷、夜视、边境 安全、搜索&救援(SAR)以及 其他应用。

XSW-640 OEM模块可探测 0.9(可选0.4)到1.7 μm之间 的短波红外辐射, 并具备大动态范围和广泛的工作 温度范围。

 热电(TE)稳定功能 可降低暗电流和噪音水平 。 结合内置的图像处理功能, 您可获得最佳对比度 和高图像质量。

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优点和特点

  • 连接便利性
    可提供各种接口
  • 高分辨率
    640x480图像分辨率
  • 欧洲制造
    使用双出口许可,易于出口——无ITAR限制
  • 较小的20 μm像素尺寸
    在灵敏度、噪音和格式之间实现出色平衡

设计用于使用

  • 边境安全
    热成像仪可探测夜间的热特征。 SWIR成像仪可用于日间和星光环境成像
  • 驾驶员辅助
    热成像仪可探测夜间的热特征。 SWIR成像仪可用于日间和星光环境成像
  • 光电有效载荷
    XTM系列和XSW核心可用作UAV无人机平台的热成像和光电有效载荷
  • 增强视觉系统(EVS)
    基于制冷型MWIR摄像机且具备宽频响应(1-5um)的飞行器着陆系统
  • 激光探测
    SWIR摄像机可用于探测隐蔽激光(瞄准激光或激光测距仪)
  • 夜间视觉(被动&主动)
    热成像仪可探测夜间的热特征。 SWIR成像仪可用于日间和星光环境成像
  • 搜索&救援
    热成像仪能够探测物体的热量 SWIR图像可通过月光或星光获得照明 对夜间搜索和救援行动至关重要
  • SWIR瞄准器
    SWIR摄像机可用于日间和星光(夜辉)条件成像
  • 无人机/地面无人车辆(UAV / UGV)
    XTM系列和XSW核心可用作UAV无人机平台的热成像和光电有效载荷

特征

兼容各种采集卡

Several compatible frame grabbers for CameraLink interface are available (Euresys Grablink Full, NI 1433 and Imperx Framelink Express VCE-CLEX01).

兼容GigE Vision标准

The Gigabit Ethernet interface is compatible to the GigE Vision standard

SWaP(小型化、轻量化和低功耗)

Small volume, low weight and low power consumption for demanding applications

触发

External trigger for signal synchronization

开窗模式(ROI模式)

Imaging in a reduced window of interest for increased frame rates

视频输出

Analog video output available

TrueNUC图像修正

Non uniformity correction for a wide range of integration times 

VisNIR选项

Visible enhanced InGaAs available (500 - 1700 nm)

高动态范围

High dynamic range mode available

昼夜(24h)均可使用

The camera can operate under daylight or nighttime conditions

摄像头规格

Array Specifications

Array Specifications XSW-640
Array type InGaAs Focal Plan Array (FPA) ROIC with CTIA topology
Spectral band 0.9 μm to 1.7 μm (VisNIR optional 0.4 to 1.7 μm)
Resolution 640 x 512
Pixel pitch 20 μm
Readout mode Integrate Then Read (ITR) Integrate While Read (IWR)
Peak Quantum Efficiency (QE) 80% 85%
ROIC noise High gain: 60 e- Low gain: 400 e-
Sensitivity High gain: 20 μV/e- Low gain: 1.6 μV/e-
Dark current 0.8 x 10⁶ e-/s
Integration capacitor High gain: 6.7 fF Low gain: 85 fF
Array cooling TE1-stabilized
Pixel operability > 99 %

Module Specifications

Module Specifications XSW-640- Samtec XSW-640- Analog XSW-640- CL XSW-640- GigE
Lens
Focal length Broad selection of lenses available
Optical interface Fixation holes for multiple lens mounts
Imaging performance
Maximum frame rate (full frame) 100 Hz 25 Hz (PAL) or 30 Hz (NTSC) 100 Hz
Window of interest Minimum size 32 x 4
Integration time range 1 μs - 40 ms
Noise level: High gain 120 e-
Noise level: Low gain 400 e-
Gain level: High gain 1.28 e-/ADU
Gain level: Low gain 16.2 e-/ADU
On-board image processing Image correction (TrueNUC for high and low gain), Auto-Gain and offset, Auto-Exposure, Histogram-Equalization, Trigger Possibilities Up to 4 NUCs, Auto-Gain, Trigger Possibilities
ADC 14 bit
Interfaces
Digital output BT.601-6/BT.656-5 - CameraLink or Xeneth API/SDK GigE Vision or Xeneth API/SDK
Analog output - PAL or NTSC -
Module control Serial LVCMOS 3 V (XSP) RS232 (XSP) CameraLink GigE Vision
Trigger Trigger in or out (configurable)
Power requirements
Power consumption +/- 2.6 W 3 W 2.8 W 4 W
Power supply 12 V
Physical characteristics
Shock 40 G, 11 ms according to MIL-STD810G
Vibration 5 G (20 Hz to 2000 Hz) according to MIL-STD883J
Operating case temperature -40ºC to 70ºC (industrial components)
Storage temperature range -40ºC to 85ºC (industrial components)
Dimensions (W x H x L mmᵌ) 45 x 45 x 51 45 x 45 x 55 45 x 45 x 65
Weight module 120 g 145 g 129 g 165 g

配件可供选择范围广泛

镜头和过滤器选项

软件

  • Xeneth
  • Xeneth SDK (optional)

文件

新闻发布
Xenics at SPIE DSS 2011: high performance infrared OEM modules for easy integration We offer high resolution infrared OEM modules in both SWIR (XSW-640) as LWIR (XTM-640) (2011)
Xenics sees strong growth ahead for OEM module business The OEM module business will grow strongly, especially in the security market. That is why we target the security market with our XenicsCores (2014)
Technical documents
T3 XSW H This is the technical drawing for the XSW camera core.

小册子

Modules & components brochure XSW-640

Xeneth LabVIEW软件开发套件(SDK)

Xenics摄像机的LabVIEW工具套件可提供 高水平的范例以及低水平的VI案例,便于编程人员将Xenics 摄像机集成到他们使用LabVIEW编写的软件 应用中。

Jan Šíma, Business Development Manager, ELCOM, a.s.